Hello to all of you, Currently,we are designing a double sided reflow board. All our assembled boards have to pass electrical test, preferably on a bed of nails. Is it good practice to close all through hole testvias by paste screening in order to create good vacuum conditions when testing ? So, I want to include these vias in the paste screen artwork. What is a good diameter in the paste screen for closing vias with a finished hole diameter of 8 mil ? Is there not a risk that the solder paste will flow through the via holes and causing shorts at the other side during the second step of reflowing ? The board has a thickness of 95 mil. Anyone has some experience in this matter ? Thanks in advance. Cor Coolen Board Designer --------------------------------------------------------------------------------- DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF DesignerCouncil. To set a vacation stop for delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------